The Applications of a TAIKO Wafer | Grinding | Solutions | DISCO …

The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer.

WhatsApp: +86 18221755073

The Center Offset Grinding of TAIKO Wafer

The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer.

WhatsApp: +86 18221755073

Thinning by Grinding Wheel (Grinding)| DISCO …

Grinding is a process in which an object is thinned and planarized by using a grinding wheel (abrasive tool for grinding). The workpiece is thinned and flattened by pressing the grinding wheel against it while rotating at …

WhatsApp: +86 18221755073

Ring Grinding | Grinding | Solutions | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently.

WhatsApp: +86 18221755073

Ring Grinding | Grinding | Solutions | DISCO Corporation

We are introducing a grinding method, which grinds the ring section of a wafer, in the TAIKO process. When mounting a TAIKO wafer onto dicing tape, if the height difference between the ring section and TAIKO section is big, a large void is generated between the tape and wafer, which has a negative impact on the dicing.

WhatsApp: +86 18221755073

Poligrind | Grinding Wheels | Product Information | DISCO Corporation

Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface roughness, die strength, and overall process quality.

WhatsApp: +86 18221755073

Dicing Thin Wafers | Blade Dicing | Solutions | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual

WhatsApp: +86 18221755073

DFP8141 | Polishers | Product Information | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual

WhatsApp: +86 18221755073

Grinding of SiC Device Wafers | Grinding | Solutions | DISCO Corporation

SiC (silicon carbide) is a semiconductor material with high voltage resistance and low power loss, and SiC wafers are used in power devices. SiC power devices generally have a vertical device structure, and thinning the wafer lowers the substrate resistance, leading to improved energy conversion efficiency.

WhatsApp: +86 18221755073

Dicing and Grinding Service | Solutions | DISCO Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are …

WhatsApp: +86 18221755073

High quality sapphire processing | Grinding | Solutions | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual

WhatsApp: +86 18221755073

Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

WhatsApp: +86 18221755073

Trouble Shooting and FAQs for DISCO Equipment

If the equipment freezes even after restarting it: Check the screen display of the touch panel when the equipment has frozen, and contact your DISCO customer engineer. If a Windows dialog box is shown on the …

WhatsApp: +86 18221755073

GF01 | Grinding Wheels | Product Information | DISCO Corporation

The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. This base delivers grinding water even more efficiently than the IF Series, resulting in highly consistent processing and optimized wheel life.

WhatsApp: +86 18221755073

DFL7160 | Laser Saws | Product Information | DISCO Corporation

DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.

WhatsApp: +86 18221755073

Diving Equipment | Commercial Dive Gear | Deep Sea Diving Equipment …

Diving equipment including commercial diving helmets, masks, accessories, customized water skis, Viking dry suits, air hats and other deep sea and commercial diving gear. Home; ... D Corporation charges an additional 3.5% in addition to the purchase price for all credit card transactions. If you would prefer to pay by check, please send a ...

WhatsApp: +86 18221755073

Training Services | DISCO Corporation

We provide training for the authorized end-users of DISCO equipment. Training Center Features Using 90% of training time in hands-on practice, trainees can learn actual operation and/or maintenance of the equipment.

WhatsApp: +86 18221755073

Trouble Shooting and FAQs for DISCO Equipment

If the equipment freezes even after restarting it: Check the screen display of the touch panel when the equipment has frozen, and contact your DISCO customer engineer. If a Windows dialog box is shown on the frozen screen, inform us of the display details as well.

WhatsApp: +86 18221755073

The Applications of a TAIKO Wafer | Grinding

The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer.

WhatsApp: +86 18221755073

Ultra-Thin Grinding | Grinding | Solutions | DISCO …

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. Application Examples. Photo 1 shows a Φ300 mm silicon …

WhatsApp: +86 18221755073

IF | Grinding Wheels | Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

WhatsApp: +86 18221755073

DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, …

WhatsApp: +86 18221755073

Ultra-Thin Grinding | Grinding | Solutions | DISCO Corporation

Photo 1: t5 µm, Φ300 mm Silicon Wafer(Supplied by Renesas Technology Corp) Equipment. The point of concern during ultra-thin grinding is how to safely handle the wafers, as their mechanical strength is reduced making them extremely easy to crack due to the reduction in thickness. In addition to using transport pads (Photo 2) of the same ...

WhatsApp: +86 18221755073

Deionized Water Recycling Unit | Accessory …

Thanks to the introduction of the compact and highly efficient CC Filter, an original DISCO invention, a small equipment footprint has been made possible. Environmentally friendly The high recycle rate (99.5% with …

WhatsApp: +86 18221755073

Manual for Old Equipment | Support | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual

WhatsApp: +86 18221755073

DISCO grinding and polishing machines and …

View DISCO grinder and polisher available for DGS. Buy high quality grinding/polishing equipment.

WhatsApp: +86 18221755073

DISCO precision machines

Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO's precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI …

WhatsApp: +86 18221755073

DAD3350 | Dicing Saws | Product Information | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual

WhatsApp: +86 18221755073

DCS1440 | Accessory Equipment | Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

WhatsApp: +86 18221755073

DCS1441 | Accessory Equipment | Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

WhatsApp: +86 18221755073

DCS1460 | Accessory Equipment | Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

WhatsApp: +86 18221755073

Semiconductor Engineering, DISCO Wafer Cutting, Grinding …

With AUROTECH CORPORATION, there is simply "No Time Out !" ... Inline with AUROTECH and Disco's commitment to provide Total Solutions to our customers it has accredited KKM Works Inc. ... FACILITY. PRODUCTION. EQUIPMENT. Join our newsletter! Follow Us On. facebook; linkedin ; Head Office. Paseo 4B, Paseo de Sta. …

WhatsApp: +86 18221755073

LEAF｜Glass processing｜DISCO Corporation

DISCO Corporation provides glass processing solutions, test cuts, and equipment. DISCO Corporation provides glass processing solutions, test cuts, and equipment. languageEnglish email. Contact. LEAF Processing. LEAF (Laser Enhanced Ablation Filling) Separation method utilizing laser ablation

WhatsApp: +86 18221755073

DISCO Corporation, The World Leader In …

DISCO holds leading market share in the production of wafer grinders, grinding wheels, wafer dicing saws, laser saws, and surface planarization. These businesses allowed DISCO to generate nearly $2B …

WhatsApp: +86 18221755073

TAIKO Process | TAIKO Process | Grinding | Solutions | DISCO Corporation

The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

WhatsApp: +86 18221755073

Discontinued Equipment List | Support | DISCO Corporation

For further information about discontinuation dates, please contact a DISCO sales representative or customer engineer. The manuals' data for old models are available for purchase. We hope you will make use of them for the maintenance of DISCO's equipment you purchased. Online Manual Store. Dicing Saws; Laser Saws; Grinders; …

WhatsApp: +86 18221755073

Products

Useful link

Contact Us

0086-21-58386256
0086-21-58386258
[email protected]

Hot Products

Copyright © 2024.FIXIN All rights reserved.sitemap